SEC X-eye 6200 Inline 2D AXI X-ray Inspection

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SEC X-eye 6200 Inline 2D AXI

  • High speed 2D In Line inspection System (0.3 sec/FOV)
  • Hybrid Tube with long life span for In-line purpose (10,000hrs/Filament)
  • WAXI : Wire Automatic X-ray Inspection Detection of wire defects possible (Shorts, sweep, mssing, etc)
In-Line X-ray Inspection System
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.
Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.
Performing X-ray inspection in various production site, integrated with other manufacturing equipments.

Description

Specifications
X-ray Tube 160 kV / 500 µA (option 130 KV / 300 µA)
Min. Resolution 0.8 ~ 15 µm
Table Size Min : 50 x 50 (mm), Max : 330 x 250 (mm)
Detector 1.6 M Pixel FPD
Objects BGA, Chip, QFN, QFP, Wire Bonding
Defects
BGA : Short, Bridging, Void
Chip : Manhattan, Miss align, Short
Wire Bonding : Sweep, Broken, Double Bonding, Missing
Dimension 1,000(W) x 1,360(D) x 1,450(H)mm / 2,000kg
SMT Chip BGA / 2D Inspection
Wire Bonding / 2D Inspection
Applications

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