Description
Specifications
| YSi-SP | ||
|---|---|---|
| Applicable PCB | L510×W460mm～L50×W50mm (single lane spec) *No dual lane specification available. |
|
| Horizontal resolution (FOV size) | 1）25µm / 12.5µm (approx. 50×50mm) 2）20µm / 10µm (approx. 40×40mm) 3）15µm / 7.5µm (approx. 30×30mm) *All are standard selection type. |
|
| Height resolution | 1µm | |
| Inspection items | Solder paste printing quality (volume, height, area and misalignment) | |
| Power supply | Single-phase AC 200V–230V ±10% | |
| Air supply source | Airless specification | |
| External dimension | L904×W1,080×H1,478 mm | |
| Weight | Approx. 550 kg | |
- Specifications and appearance are subject to change without prior notice.
External dimension
Function and Feature
“1-head solution” to perform various inspections with a single head
Accurate inspections by unique measurement algorithm combining 2D and 3D
Extensive machine-to-machine (M2M) solution
Statistical Process Control (SPC) for diverse statistical processing
“1-head solution” to perform various inspections with a single head
One head type supports all types of inspections. Eliminate all types of losses such as time and cost to increase your actual productivity.
Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
Highly accurate 3D inspections by applying unique 3-step algorithm
01Focus adjustment
02Surface area measurement
03Height measurement
High precision 2D contour extraction
Reproduces accurate shapes by combining with phase shift method.
Mounter data
Makes inspection data
Supports high-speed and high-resolution inspections in just one unit!
Super high resolution technology delivers switchable resolution for each visual field.
Extensive machine-to-machine (M2M)solution
The Yamaha brand can provide all main equipment needed for component mounting in one package and by linking SPI with each piece of equipment creates a production line having boosted quality and productivity.
Automatic setup changes
Settings such as production line PCB data and conveyor width are sequentially sent from upstream units by scanning ID such as for barcodes listed on PCB and instruction sheets to automatically to shorten the time needed to switch setups and make changeovers.
Feedback print offset
Feedback print offset and initiate cleaning cycle acquired by SPI to the downstream printer to give high print quality.
Remote pass-fail judgment
One PC handles second pass-fail judgment of both AOI and SPI. This makes better job efficiency of second pass-fail judgment.
Automatically converts coating inspection data
Create coating data from the dispenser and send to SPI in just one click!
Statistical Process Control (SPC) for diverse statistical processing
Saves all pad images and measurement data, performs statistics and analysis of holes and slits by multiple methods, software from 1 PC connects to up to 6 SPI units.
Extension conveyor boosts job efficiency
Extension conveyor available with shutters on the IN and OUT ends. Better job efficiency for PCB removal and check tasks.
![](mailto:?Subject=Yamaha 3D High-speed Solder Paste Inspection Machine YSi-SP&Body=<figure class="rwd-pc-margin-bottom30 rwd-sp-margin-bottom15"><img src="https://global.yamaha-motor.com/business/smt/inspectionsystem/ysi-sp/img/logo.gif" alt="3D High-speed Solder Paste Inspection Machine YSi-SP" /></figure>
<p class="rwd-text rwd-text-large rwd-text-bold rwd-pc-margin-bottom30 rwd-sp-margin-bottom15">Eagerly awaited SPI from Yamaha Gives your one stop solution from printing machine to AOI</p>
<ul class="rwd-product-notation">
<li>“1-head solution” to perform various inspections with a single head</li>
<li>Achieves high-accuracy high-speed inspections using 3D 2D inspection, image resolution switch-over and more</li>
<li>A thorough and extensive machine-to-machine (M2M) solution</li>
<li>Statistical Process Control (SPC) for diverse statistical processing</li>
<li>Optional features to enable handling various products</li>
</ul>
https://youtu.be/r6h2j4HtRoU){kind=link}
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