KISS-103ILDP

24″ x 18″ PCB In-Line Dual Pot

The KISS-103ILDP is a “super high speed” in-line DUAL SOLDER POT Selective Soldering Machine with up to four separate solder nozzles usable within the same program. Simply stated…SPEED and PROCESS CONTROL…The KISS-103ILDP effectively splits the soldering process allowing 50% of the sites to be soldered at the 1st station and the balance soldered at the 2nd station. This significantly increases productivity by reducing TAKT by up to 50% vs. incremental processing. The KISS-103ILDP is two to three times faster versus conventional machines.




Description

Lead Solder Pot-Pump Assy
Lead-Tin Alloy Solder Pot and Pump Assembly with standard KISS magnetic chuck which holds all standard selective soldering nozzles.

Heated N²
Heated nitrogen to the solder nozzle

Programming Camera
The primary camera for the SWAK-OS used for programming and single or two-point fiducial correction

KISS Board Warp Compensation System

Solder Level Check
Automated solder pot level check and top-off

Wave Height Verification
Automated in process solder wave height check/adjust.

Solder Alloy Verification
Our unique solder pot system automatically detects what alloy pot has been installed and will not allow process to begin with incorrect alloy pot in place.

Spray Fluxer
Precision atomizing flux applicator.

Witness Camera
Fixed position camera used to observe the soldering process.

Fiducial Correction System
Automatic single or two-point fiducial correction for PCB location and rotation.

Included Solder Nozzles
6mm and 12mm bullet nozzles – alternate size bullet nozzles upon request.